Advanced Thermal Solutions Inc. - ATS-19A-18-C2-R0

KEY Part #: K6263534

ATS-19A-18-C2-R0 Pryse (USD) [13245stuks Voorraad]

  • 1 pcs$3.11134
  • 10 pcs$2.87248
  • 30 pcs$2.71280
  • 50 pcs$2.55324
  • 100 pcs$2.39366
  • 250 pcs$2.23408
  • 500 pcs$2.07451
  • 1,000 pcs$2.03461

Onderdeel nommer:
ATS-19A-18-C2-R0
vervaardiger:
Advanced Thermal Solutions Inc.
Gedetailleerde beskrywing:
HEATSINK 54X54X15MM XCUT T766.
Manufacturer's standard lead time:
In voorraad
Raklewe:
Een jaar
Chip van:
Hong Kong
RoHS:
Betalings metode:
Gestuur manier:
Gesinskategorieë:
KEY Components Co, LTD is 'n verspreider van elektroniese komponente wat produkkategorieë insluitend: Termiese pads, lakens, Termiese - vloeibare afkoeling, Termies - koelbakke, Termiese - hittepype, dampkamers, Termies - termoelektries, Peltier-byeenkomste, Termies - gom, epoksies, ghries, pasta, Termies - gom, epoksies, ghries, pasta and Termies - termoelektries, Peltier-modules ...
Kompeterende voordeel:
Ons spesialiseer in Advanced Thermal Solutions Inc. ATS-19A-18-C2-R0 elektroniese komponente. ATS-19A-18-C2-R0 kan binne 24 uur na bestelling gestuur word. Indien u enige eise vir ATS-19A-18-C2-R0 het, moet u 'n kwotasieversoek hier of stuur vir ons 'n e-pos: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-19A-18-C2-R0 Produkkenmerke

Onderdeel nommer : ATS-19A-18-C2-R0
vervaardiger : Advanced Thermal Solutions Inc.
beskrywing : HEATSINK 54X54X15MM XCUT T766
reeks : pushPIN™
Deelstatus : Active
tipe : Top Mount
Pakket afgekoel : Assorted (BGA, LGA, CPU, ASIC...)
Aanhegselmetode : Push Pin
vorm : Square, Fins
lengte : 2.126" (54.01mm)
wydte : 2.126" (54.00mm)
deursnee : -
Hoogte buite basis (Hoogte van vin) : 0.590" (15.00mm)
Kragdissipasie @ temperatuurstyg : -
Termiese weerstand @ gedwonge lugvloei : 13.38°C/W @ 100 LFM
Termiese weerstand @ Natuurlik : -
materiaal : Aluminum
Materiële afwerking : Blue Anodized

U mag ook belangstel in
  • 511-9U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x228.6mm

  • 511-9M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks H/S 5.21 X 9.00"

  • 511-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm

  • 511-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x152.4mm

  • 511-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm

  • 510-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY.