Advanced Thermal Solutions Inc. - ATS-X53375P-C1-R0

KEY Part #: K6263900

ATS-X53375P-C1-R0 Pryse (USD) [4772stuks Voorraad]

  • 1 pcs$9.00192
  • 10 pcs$8.50387
  • 25 pcs$7.61318
  • 50 pcs$7.13731

Onderdeel nommer:
ATS-X53375P-C1-R0
vervaardiger:
Advanced Thermal Solutions Inc.
Gedetailleerde beskrywing:
SUPERGRIP HEATSINK 37X37X17.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 37.5x37.5x17.5mm
Manufacturer's standard lead time:
In voorraad
Raklewe:
Een jaar
Chip van:
Hong Kong
RoHS:
Betalings metode:
Gestuur manier:
Gesinskategorieë:
KEY Components Co, LTD is 'n verspreider van elektroniese komponente wat produkkategorieë insluitend: Termies - gom, epoksies, ghries, pasta, Termies - koelbakke, Termies - gom, epoksies, ghries, pasta, Termiese pads, lakens, Fans - Toebehore - Fan cords, Termies - termoelektries, Peltier-modules, Termiese - hittepype, dampkamers and AC fans ...
Kompeterende voordeel:
Ons spesialiseer in Advanced Thermal Solutions Inc. ATS-X53375P-C1-R0 elektroniese komponente. ATS-X53375P-C1-R0 kan binne 24 uur na bestelling gestuur word. Indien u enige eise vir ATS-X53375P-C1-R0 het, moet u 'n kwotasieversoek hier of stuur vir ons 'n e-pos: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-X53375P-C1-R0 Produkkenmerke

Onderdeel nommer : ATS-X53375P-C1-R0
vervaardiger : Advanced Thermal Solutions Inc.
beskrywing : SUPERGRIP HEATSINK 37X37X17.5MM
reeks : superGRIP™
Deelstatus : Active
tipe : Top Mount
Pakket afgekoel : BGA
Aanhegselmetode : Clip, Thermal Material
vorm : Square, Fins
lengte : 1.457" (37.00mm)
wydte : 1.457" (37.00mm)
deursnee : -
Hoogte buite basis (Hoogte van vin) : 0.689" (17.50mm)
Kragdissipasie @ temperatuurstyg : -
Termiese weerstand @ gedwonge lugvloei : 3.50°C/W @ 200 LFM
Termiese weerstand @ Natuurlik : -
materiaal : Aluminum
Materiële afwerking : Blue Anodized

U mag ook belangstel in
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.