CTS Thermal Management Products - BDN15-3CB/A01

KEY Part #: K6235966

BDN15-3CB/A01 Pryse (USD) [44465stuks Voorraad]

  • 1 pcs$0.87934
  • 1,000 pcs$0.81421

Onderdeel nommer:
BDN15-3CB/A01
vervaardiger:
CTS Thermal Management Products
Gedetailleerde beskrywing:
HEATSINK CPU W/ADHESIVE 1.51SQ.
Manufacturer's standard lead time:
In voorraad
Raklewe:
Een jaar
Chip van:
Hong Kong
RoHS:
Betalings metode:
Gestuur manier:
Gesinskategorieë:
KEY Components Co, LTD is 'n verspreider van elektroniese komponente wat produkkategorieë insluitend: Termiese pads, lakens, Termies - gom, epoksies, ghries, pasta, AC fans, Termies - koelbakke, Termies - termoelektries, Peltier-modules, DC-aanhangers, Termies - gom, epoksies, ghries, pasta and Termiese - hittepype, dampkamers ...
Kompeterende voordeel:
Ons spesialiseer in CTS Thermal Management Products BDN15-3CB/A01 elektroniese komponente. BDN15-3CB/A01 kan binne 24 uur na bestelling gestuur word. Indien u enige eise vir BDN15-3CB/A01 het, moet u 'n kwotasieversoek hier of stuur vir ons 'n e-pos: rfq@key-components.com
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN15-3CB/A01 Produkkenmerke

Onderdeel nommer : BDN15-3CB/A01
vervaardiger : CTS Thermal Management Products
beskrywing : HEATSINK CPU W/ADHESIVE 1.51SQ
reeks : BDN
Deelstatus : Active
tipe : Top Mount
Pakket afgekoel : Assorted (BGA, LGA, CPU, ASIC...)
Aanhegselmetode : Thermal Tape, Adhesive (Included)
vorm : Square, Pin Fins
lengte : 1.510" (38.35mm)
wydte : 1.510" (38.35mm)
deursnee : -
Hoogte buite basis (Hoogte van vin) : 0.355" (9.02mm)
Kragdissipasie @ temperatuurstyg : -
Termiese weerstand @ gedwonge lugvloei : 4.50°C/W @ 400 LFM
Termiese weerstand @ Natuurlik : 15.10°C/W
materiaal : Aluminum
Materiële afwerking : Black Anodized

U mag ook belangstel in
  • 512-9M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x228.6mm

  • 512-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x152.4mm

  • 510-3M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x76.2mm

  • 510-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks HEATSINK

  • 122260

    Wakefield-Vette

    HEATSINK 19035 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 19035, 12x9.24x2.7 Inch

  • 122255

    Wakefield-Vette

    HEATSINK 13694 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 13694, 12x6.9x2.8 Inch