Octavo Systems OSD335x-SM Family of System-In-Package Devices

Author : Octavo systems Published Time : 2018-05-29
Octavo Systems OSD335x-SM System-in-Package (SiP) is the smallest Arm Cortex®-A8 Texas Instruments Sitara based module.  It integrates TI AM335x processor running up to 1GHz with up to 1GB of DDR3 memory, 2 power supplies, EEPROM, and over 100 passives components.  All of this is backed into a single ease to use 21mm X 21mm BGA that is 60% smaller than an equivalent discrete system.

Features

Integrated into a single BGA Package:
Texas Instruments Sitara™ AM335x ARM® Cortex®-A8 ProcessorUp to 1GB DDR3L MemoryTPS65217C Power Management IC (PMIC)TL5209 LDO4KB EEPROMPassivesTI AM335x Features:
Up to 1GHz8 Channel 12-bit SAR ADCEthernet 10/100/1000 x2USB 2.0 HS OTG + PHY x2MMC, SD, and SDIO x3LCD controllerSGX 3D graphics enginePRU subsystemAccess to all AM335x peripherals
CAN, SPI, UART, I2C, and GPIOSupport for Popular Industrial Protocols:
EtherNet/IPSerco IIIPROFIBUSPROFINET RT/IRT
Octavo systems Newest

Octavo Systems OSD335x-SM Industrial Rated System-in-Package (SiP) provides OEM and system developers the added benefit of the full industrial temperature range (-40°C to 85°C).

Date: 2018-05-29

Octavo Systems OSD3358-SM-Red Evaluation Board is the official reference, evaluation, and development platform for the OSD335x-SiP family.

Date: 2017-10-26